1. Introduction

The ML307Y is an LTE Cat.1 wireless communication module launched by China Mobile IoT Co., Ltd. Designed for consumer‑grade products, it delivers high integration and reliability and fits a wide range of IoT applications.

2. Package & Dimensions

The module adopts a hybrid LCC+LGA package with 109 pins in total (48 LCC pins and 61 LGA pins). Its physical dimensions are 17.7 mm × 15.8 mm × 2.2 mm, making it compact and easy to embed in various end devices.

3. Sub‑models

At present, the ML307Y family mainly includes the ML307Y‑DL variant. This model integrates 4 MB pSRAM and 2 MB Flash, and fully supports the networks of China Mobile, China Telecom, and China Unicom.

4. Radio Access & Bands

The ML307Y‑DL supports both LTE‑FDD and LTE‑TDD.

• LTE‑FDD bands: Band 1/3/5/8

• LTE‑TDD bands: Band 34/38/39/40/41

5. Core Performance & Specifications

Throughput (theoretical):

• LTE‑FDD: downlink up to 10 Mbps; uplink up to 5 Mbps

• LTE‑TDD: downlink up to 9.010 Mbps; uplink up to 3.096 Mbps

Power Supply & Consumption:

• Typical operating voltage: 3.8 V (range 3.4 V to 4.5 V).

• During TX bursts, instantaneous current can reach 2 A. Ensure VBAT never drops below 3.4 V. Use an LDO or DCDC capable of ≥2 A output and place at least two 220 µF bulk capacitors in parallel on VBAT.

Operating Temperatures:

• Normal operating temperature: −30 °C to +75 °C

• Extended operating temperature: −40 °C to +85 °C

• Storage temperature: −45 °C to +90 °C

Rich Hardware Interfaces:

• 3× UART

• 1× USB 2.0

• 1× USIM

• 1× Main RF antenna

• 7× control interfaces (PWR, reset, status indicators, etc.)

• 4× GPIO

• 2× PWM

• 2× ADC

Software & Protocols:

• IPv4/IPv6 dual stack; supports PING, NTP, DNS, TCP, UDP, SSL, HTTP(S), MQTT(S), etc.

• USB drivers available for Windows 7/10, Linux, and Android 4.x–11.x.

• Firmware upgrade via USB.

6. Interface Details

Power:

• VBAT (Pin 42, 43): main power input.

• VDD_EXT (Pin 24): 1.8 V / 50 mA output for pull‑ups; leave floating if unused.

Serial (UART):

• UART0 (main AT port), default 115200 bps

• UART1 (auxiliary)

• DBG (log), default 115200 bps

Note: logic level is 1.8 V; use level shifting when interfacing to other voltage domains.

USB:

• USB 2.0 High‑Speed (up to 480 Mbps) for AT commands, data, debugging, and firmware upgrade.

• USB_VBUS (Pin 61) accepts 5 V input.

• Route D+/D− as 90‑Ω differential pair; apply ESD protection.

USIM:

• 1× USIM interface; supports 1.8 V / 3 V SIM; compliant with ISO 7816.

• USIM0_DET (Pin 79) supports hot‑plug detection.

• For signal integrity, pull up USIM_DATA to USIM_PWR with 10 kΩ; add 33 pF to GND on CLK/DATA/RST to mitigate RF interference.

GPIO:

• 4× GPIO (GPIO0..GPIO3), configurable via AT; 1.8 V domain.

• Note: GPIOs are unavailable in sleep mode.

ADC:

• 2× 12‑bit ADC (ADC0, ADC1), input range 0–1.4 V; typical accuracy within 50 mV.

Control:

• PWR_ON/OFF (Pin 7): active‑low; pull low 2–3.5 s to power on; when on, pull low 3.5–4 s to power off.

• RESET (Pin 15): active‑low hardware reset.

• NETLIGHT (Pin 16) and STATE (Pin 25): LED indicators for network and module status.

• WAKEUP_OUT (Pin 49): sleep wake output.

• BOOT_MODE (Pin 82): USB force‑download mode, active‑high.

• PWM (Pin 74, 75): two PWM outputs.

7. RF & Manufacturing

RF Performance:

• TX power: 23 dBm ± 2 dB.

• The hardware guide specifies conducted RX sensitivity, conducted TX power, and antenna design requirements (efficiency, gain, VSWR, etc.) to ensure optimal performance.

Mechanical & Production:

• The guide provides top/bottom views, recommended PCB footprint, and reflow soldering profile, enabling reliable manufacturing.

8. Summary

The ML307Y is a compact, highly integrated LTE Cat.1 module featuring stable performance and rich interfaces. With broad temperature tolerance and full support for China’s three major operators, it is well‑suited for smart metering, mobile payment, shared devices, security monitoring, industrial data transmission, and more. For best results, carefully follow the hardware design manual—especially for power delivery, RF/antenna design, and IO level matching—to fully realize the module’s capabilities.