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    • Backlit LED chip "Can" series

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    Chip Size Chip thickness P bonding pad N bonding pad Substrate materia Epitaxy structure P electrode(anode) N electrode(cathode) Luminous Intensity Dominant Wavelength Forward Voltage











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    Part Number Chip Size Chip thickness P bonding pad N bonding pad Substrate materia Epitaxy structure P electrode(anode) N electrode(cathode) Luminous Intensity Dominant Wavelength Forward Voltage
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