Product overview

Smart watch chip series products are mainly dual-mode Bluetooth 5.3 single-chip solutions. It adopts MCU+DSP dual-core architecture, which has the characteristics of low power consumption, high frame rate and superior Bluetooth performance, and supports AI ENC call noise reduction technology. Highly integrated graphics acceleration engine and Sensorhub module, Bluetooth RF and baseband, power management unit (PMU), audio codec, screen and sensor peripheral interface module, etc. Under the premise of being good at low-power technology, smart wearable products can be given high-smooth display and long standby time.

At present, the main smart watch chips are: ATS3085L/3085C/3085, ATS3085E, ATS3085S, ATS3089 and so on.

Bluetooth headset chip series products are mainly dual-mode Bluetooth 5.3 single-chip solutions, which have the characteristics of high sound quality, low delay and low power consumption, and are mainly used in wearable audio devices such as true wireless headsets (TWS), neck-mounted headsets and headphones. It is good at providing wireless audio experience with high sound quality and low delay under the premise of low power consumption. The Bluetooth transmitting power of this series of products is up to 13dBm and the receiving sensitivity is -96dBm, which effectively improves the stability of wireless audio connection, and the no-load power consumption is as low as 4.xmA in the case of normal audio playback. 20-segment audio PEQ, supporting sound adjustment in music and call scenes; Support dual connection, and connect any two Bluetooth devices at the same time, which is convenient for switching; Adaptive low delay mode, the delay of Bluetooth audio signal is less than 50ms, allowing users to enjoy the real restored sound with lower delay; Built-in AI single and double microphone call noise reduction algorithm greatly improves the user's call experience.

At present, the main Bluetooth headset chips are: ATS3015E, ATS3015S, ATS3019E, ATS3025, ATS3039 and so on.

Soundbar chip series products are mainly dual-mode Bluetooth 5.3 solutions, which have the characteristics of high sound quality, low delay and multi-connection, and are mainly used in Soundbar TV speakers, A/V receivers and other products.

ATS2835P supports LE Audio, supports the coexistence of classic Bluetooth reception and LeaAudio forwarding, supports multi-connection (up to 1TX+4RX+4.0 channel wireless transceiver), and the delay is as low as 16ms (based on LC3+HR). At the same time, compared with classic Bluetooth (SBC), LE Audio (LC3/LC3+) ensures better sound quality, and THD+N is as high as 90db. ATS2833P adopts smaller package and leaner BOM, which is a more cost-effective choice for RX. ATS2853 only supports classic Bluetooth, and can realize soundbar+subwoofer products with high integration and high cost performance by using TWS mechanism.

At present, the main Bluetooth speaker chips are: ATS2835P, ATS2833P and ATS2853.

Bluetooth speaker chip series products are mainly dual-mode Bluetooth 5.3 single-chip solutions, which have the characteristics of high sound quality, low delay and low power consumption. They are mainly used in portable Bluetooth speakers, soundbar TV speakers, car Bluetooth audio and other products, and can also be used as Bluetooth intelligent voice assistants with mobile phones.

He is good at providing high-quality and low-delay wireless audio experience under the premise of low power consumption. The whole series of products have advanced high-quality audio technology and low-delay technology. In the classic Bluetooth low-delay mode, the delay of Bluetooth audio signal is as low as 50ms, allowing users to enjoy real restored sound with lower delay in specific usage scenarios such as video viewing and mobile games. Support sound adjustment such as app/apk, TWS, local playback and multi-segment PEQ and DRC; Some products support Audio Broadcast, Multi point, Hi-Res, special sound adjustment and low delay mode; Among them, the Audio Broadcast application supports the combined playback of hundreds of speakers, and the distance can reach tens of meters. In addition, for example, ATS283XP has been leading the way in supporting LE Audio, and based on LE Audio technology, ATS283XP can achieve ultra-low delay of less than 20ms.

At present, the main Bluetooth speaker chips are: ATS2835P(L), ATS2835, ATS2833PM, ATS2853P, ATS2853 and so on.

The series of wireless transceiver products are mainly dual-mode Bluetooth 5.3 single-chip solutions, which adopt a dual-core heterogeneous architecture of CPU and DSP, and have the characteristics of high sound quality, low delay, high integration, low power consumption and high performance, and can be widely used in all kinds of Bluetooth transceiver products. Such as e-sports headset and dongle, wireless microphone, conference speaker dongle, traffic headset dongle, TV dongle, game console dongle, walkie-talkie adapter, Bluetooth transmission slave module, transceiver slave module, projector /CD/DVD and other related products that need to support Bluetooth transmission (connecting Bluetooth headset or Bluetooth speaker) and low-delay wireless audio transmission and reception.

This series of products integrates Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and micro-control unit (MCU). Bluetooth has a maximum transmitting power of 13dBm and a receiving sensitivity of -96dBm, with complete specifications and leading performance. Support one for two (connecting two Bluetooth speakers or Bluetooth headsets at the same time), support many audio input sources such as linein, USB, SPDIF (optical fiber or coaxial), I2S, MIC, SD/MMC, SPI, support full-format audio decoding, support screen display, support mainstream Bluetooth speakers and Bluetooth headsets in the market, support HFP AG 16K high-definition calls, support two-way simultaneous transmission of 48K high-definition voice, and support WIN 7/8.

Specializing in providing high-quality and low-delay wireless audio experience with low power consumption, this series of main products have advanced high-quality audio technology and low-delay technology. The end-to-end delay of HFP call (the whole link from dongle to speaker) is as low as 60ms, which supports the latest LE Audio. The lowest end-to-end delay of the whole link in LE Audio mode is as low as 10ms, which is at the leading level in the industry.

At present, the main Bluetooth transmitting and receiving integrated chips are: ATS2831P(L), ATS3031, ATS2851, etc.