XTX memoryIC
Multi-Series, Precisely Targeted
To meet varied application needs, XTX designs and offers a diversified lineup of NAND products:
SPI NAND Series
XT26G08DWSIGA / 26G08DWSIGA
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Capacity: 8 Gbit
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Operating Voltage: 2.7–3.6 V
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Temperature Range: −40°C to +85°C
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Package: WSON8 (8 × 6 mm)
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Features: Supports Quad I/O high-speed data interface; ideal for space-constrained wearables, IoT devices, and portable electronics.
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Product Status: Mass production (CS), stable supply.
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Parallel NAND Series
XT27Q04A8BFIGA
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Capacity: 4 Gbit
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Operating Voltage: 1.7–1.9 V
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Temperature Range: −40°C to +85°C
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Package: BGA67 (8 × 6.5 × 0.89 mm)
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ECC Requirement: 8-bit ECC
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Features: P-SLC NAND technology delivers higher read/write speeds and longer endurance; suitable for industrial-grade storage.
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Product Status: Mass production (CS), high reliability.
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XT27Q02A8BFIGA
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Capacity: 2 Gbit
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Operating Voltage: 1.7–1.9 V
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Temperature Range: −40°C to +85°C
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Package: BGA67 (8 × 6.5 × 0.89 mm)
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ECC Requirement: 8-bit ECC
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Features: P-SLC technology for high performance and stability; ideal for embedded systems and industrial control equipment.
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SD NAND Series
(Details to be provided.)
NAND MCP Series
63M4G8E6MM-CBBIA
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Memory Configuration: 4G NAND (8-bit ECC, x8) + 4G LPDDR4X (x16)
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Operating Voltage: 1.8 V (NAND) / 1.1 V (LPDDR4X) / 0.6 V (I/O)
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Temperature Range: −40°C to +85°C
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Package: BGA149 (8 × 9.5 × 0.8 mm)
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Features: Integrates high-speed storage with low-power LPDDR4X DRAM; tailored for mobile communications and smart terminals to boost overall performance and power efficiency.
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Product Status: Engineering sample (ES), suited for early development and validation.
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Horizontal Layout: Flexible Packaging for All Scenarios
XTX offers multiple packaging options to meet differing needs for size, performance, and deployment environment:
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WSON8: Compact (8 × 6 mm); ideal for wearables, IoT, and consumer devices; saves board space and simplifies circuitry.
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BGA67: Small footprint (8 × 6.5 × 0.89 mm) with high-density pinout; especially suitable for space-limited, high-performance industrial control and embedded systems.
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BGA149: Highly integrated (8 × 9.5 × 0.8 mm); geared toward high-performance mobile devices such as smartphones and tablets, offering excellent storage and processing capability.
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Combined Advantages: Reliable Performance, Stable Supply
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Wide Operating Temperature: −40°C to +85°C ensures stable operation in harsh environments.
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Flexible Voltage Options: Multiple ranges (1.7–3.6 V) to fit different power conditions.
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Robust ECC Capability: Up to 8-bit ECC safeguards data integrity and longevity.
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Stable Supply Chain Management: Clear classification of mass production (CS) vs. engineering sample (ES) to ensure smooth ramp from sampling to volume production.
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